1. 2. 3. material content data sheet sales product name bss315p h6327 issued 29. august 2013 ma# MA000939930 package pg-sot23-3-5 weight* 9.39 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip non noble metal tin 7440-31-5 0.004 0.05 470 noble metal gold 7440-57-5 0.017 0.18 1823 inorganic material silicon 7440-21-3 0.194 2.07 2.30 20656 22949 leadframe non noble metal chromium 7440-47-3 0.009 0.10 963 inorganic material silicon 7440-21-3 0.001 0.01 64 non noble metal titanium 7440-32-6 0.003 0.03 321 non noble metal copper 7440-50-8 3.000 31.97 32.11 319697 321045 wire non noble metal copper 7440-50-8 0.046 0.50 0.50 4952 4952 encapsulation organic material carbon black 1333-86-4 0.057 0.60 6048 plastics epoxy resin - 1.220 13.00 130033 inorganic material silicondioxide 60676-86-0 4.399 46.87 60.47 468724 604805 leadfinish non noble metal tin 7440-31-5 0.150 1.59 1.59 15944 15944 plating noble metal silver 7440-22-4 0.284 3.03 3.03 30305 30305 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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